期刊简称: | J ELECTRON PACKAGING |
期刊全称: | JOURNAL OF ELECTRONIC PACKAGING |
出版地址: | ASME, TWO PARK AVE, NEW YORK, USA, NY, 10016-5990 |
索引数据库: | ARTS & HUMANITIES CITATION INDEX; Current Contents-Engineering, Computing & Technology ; Current Contents Collections-Electronics & Telecommunications Collection; SCIE (Science Citation Index Expanded) |
Pindex | 期刊JOURNAL OF ELECTRONIC PACKAGING派博系数(Pindex)
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Pindex 学科排名 | 期刊JOURNAL OF ELECTRONIC PACKAGING历年Pindex在学科电机及电子中的排名图
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